System for Real-Time Measurement of Thermally Induced PWB/PWA Warpage-Reference-Cited by-同舟云学术

System for Real-Time Measurement of Thermally Induced PWB/PWA Warpage

Published:1997-03-01 Issue:1 Volume:119 Page:1-7
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Stiteler M. R.¹,Ume I. C.²

Affiliation:

1. South Carolina Research Authority, 5300 International Blvd., North Charleston, SC 29418

2. School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0405

Abstract

An automated on-line warpage measurement system for printed wiring board assemblies (PWBAs) has been developed. The system is capable of simulating an infrared reflow soldering process and performing real-time PWBA warpage measurements using the shadow moire´ technique. The system can be used to characterize the warpage behavior of virtually any PWBA during infrared soldering processes as well as during operational conditions. Using this system, warpage of PWB test vehicles was measured during simulated infrared reflow soldering. The measurement results and the measurement system will be presented. The measured warpage varied significantly during reflow soldering from that observed both before and after reflow. These results help us to understand how the board deforms at every stage of the reflow process.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/119/1/1/5567060/1_1.pdf

Reference7 articles.

1. Chang, F. P., “Moire´ Methods of Strain Analysis,” SESA Manual on Experimental Stress Analysis, 3rd ed., pp. 290–308.

2. Fu C. , and UmeC., 1995, “Characterizing the Temperature Dependence of Electronic Packaging Material Properties,” JOM, Vol. 47, No. 6, pp. 31–35.

3. Guo, Y., 1995, “Application of Shadow Moire´ Method in Electronic Packaging,” Proceedings, 1995 SEM Spring Conference and Exhibit, Grand Rapids, MI, June 12–14.

4. Kobayashi, A., ed., Handbook on Experimental Mechanics, Prentice Hall, NJ, pp. 282–313.

5. Tsang, C., Stiteler, M., and Ume, C., 1995, “Real-Time Measurement of Printed Wiring Board Flatness in a Simulated Manufacturing Environment,” INTERpack ’95, Lahaina, Hawaii, March 26–30.

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