Correlation Study of Mobile DRAM Warpage
Author:
Affiliation:
1. P&T Technology Team Samsung Electronics (Suzhou) Semiconductor Co., Ltd.,Suzhou,China
2. Samsung Semiconductor China R&D,Suzhou,China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9872527/9872536/09873333.pdf?arnumber=9873333
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3. Non-linear Viscoelastic Modeling of Epoxy Based Molding Compound for Large Deformations Encountered in Power Modules
4. Study of Warpage Measurement System for Packaging Substrate Based on Shadow Moire Method;shao;Huazhong University of Science and Technology,2012
5. Effects of package design on top PoP package warpage;zhao;58th IEEE-Electronic Components and Technology Conference,2008
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