Temperature Distribution in Advanced Power Electronics Systems and the Effect of Phase Change Materials on Temperature Suppression During Power Pulses-Reference-Cited by-同舟云学术

Temperature Distribution in Advanced Power Electronics Systems and the Effect of Phase Change Materials on Temperature Suppression During Power Pulses

Published:2000-10-01 Issue:3 Volume:123 Page:211-217
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Evans A. G.¹,He M. Y.²,Hutchinson J. W.³,Shaw M.⁴

Affiliation:

1. Princeton University, Materials Institute, Princeton, NJ 08540

2. Materials Department, University of California, Santa Barbara, CA 93106

3. Division of Engineering and Applied Sciences, Harvard University, Cambridge, MA 02138

4. Rockwell International, Thousand Oaks, CA 91360

Abstract

A thermal analysis has been performed for a package design pertinent to power electronics. The objective has been the derivation of straightforward expressions that relate the materials used and their physical dimensions to the power input and the junction temperature. This has been done for both steady-state operating conditions and for pulses. The role of phase change materials (PCMs) in suppressing temperature elevations during pulses is also addressed.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/123/3/211/5882429/211_1.pdf

Reference14 articles.

1. ASM Electronics Materials Handbook, 1986, Volume 1, Packaging, ASM International.

2. Taraseiskey, H., 1996, Power Hybrid Circuit Design and Manufacture, Marcel Dekker, Inc.

3. Sze, S. M., 1981, Physics of Semiconductor Devices, Wiley, NY.

4. McCluskey, F. P., 1997, High Temperature Electronics, CRC Press.

5. Tummala, R. R., and Rymaszewski, E. J., 1989, Microelectronics Packaging Handbook, Van Nostrand Reinhold.

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