Author:
Tummala Rao R.,Rymaszewski Eugene J.,Klopfenstein Alan G.
Cited by
53 articles.
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1. Encapusulation Materials for Power Device Packaging;Journal of The Japan Institute of Electronics Packaging;2021-08-01
2. Packaging and Integration Technologies;Radio Frequency Micromachined Switches, Switching Networks, and Phase Shifters;2019-05-03
3. Introduction;Handbook of Electronic Package Design;2018-10-24
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5. Bibliography;Non-linearities in Passive RFID Systems;2018-01-19