Effects of Varying Geometrical Parameters on Boiling From Microfabricated Enhanced Structures

Author:

Ramaswamy C.1,Joshi Y.2,Nakayama W.3,Johnson W. B.4

Affiliation:

1. IBM Corporation, Hopewell Junction, NY 12533

2. G. W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332

3. ThermTech International, Kanagawa, Japan 255-0004

4. Laboratory for Physical Sciences, College Park, MD 20740

Abstract

The current study involves two-phase cooling from enhanced structures whose dimensions have been changed systematically using microfabrication techniques. The aim is to optimize the dimensions to maximize the heat transfer. The enhanced structure used in this study consists of a stacked network of interconnecting channels making it highly porous. The effect of varying the pore size, pitch and height on the boiling performance was studied, with fluorocarbon FC-72 as the working fluid. While most of the previous studies on the mechanism of enhanced nucleate boiling have focused on a small range of wall superheats (0–4 K), the present study covers a wider range (as high as 30 K). A larger pore and smaller pitch resulted in higher heat dissipation at all heat fluxes. The effect of stacking multiple layers showed a proportional increase in heat dissipation (with additional layers) in a certain range of wall superheat values only. In the wall superheat range 8–13 K, no appreciable difference was observed between a single layer structure and a three layer structure. A fin effect combined with change in the boiling phenomenon within the sub-surface layers is proposed to explain this effect.

Publisher

ASME International

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference14 articles.

1. Thome, J. R., 1990, Enhanced Boiling Heat Transfer, Hemisphere Publishing, NY.

2. Webb, R. L., 1994, Principles of Enhanced Heat Transfer, John Wiley & Sons, NY.

3. Oktay, S., 1982, “Departure From Natural Convection (DNC) in Low-Temperature Boiling Heat Transfer Encountered in Cooling Microelectronic Devices,” Proceedings of the 7th International Heat Transfer Conference, 4, Hemisphere Publishing, NY, pp. 113–118.

4. Nakayama, W., Nakajima, T., and Hirasawa, S., 1984, “Heat Sink Studs Having Enhanced Boiling Surfaces For Cooling Microelectronic Components,” ASME Paper No. 84-WA/HT-89.

5. Mudawar, I., and Anderson, T. M., 1993, “Optimization of Enhanced Surfaces for High Flux Chip Cooling by Pool Boiling,” ASME J. Electron. Packag., 115, pp. 89–100.

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