Analytical Solution for Electronic Assemblies Under Vibration-Reference-Cited by-同舟云学术

Analytical Solution for Electronic Assemblies Under Vibration

Published:2016-03-01 Issue:1 Volume:138 Page:
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Gharaibeh Mohammad A.¹,Su Quang T.¹,Pitarresi James M.¹

Affiliation:

1. Mechanical Engineering Department, Thomas J. Watson School of Engineering and Applied Sciences, Binghamton University, State University of New York, 4400 Vestal Parkway East, Binghamton, NY 13902-6000 e-mail:

Abstract

An analytical solution using Ritz method for the electronic assembly vibration problem has been presented in detail. In this solution, a special treatment for plate-mounted-on-standoffs boundary conditions scheme was required, and hence described. Also, a simple equation for estimating ball grid array (BGA) solder joint axial stiffness was developed. The results of the analytical solution were validated with modal analysis measurements and finite element (FE) models data in terms of natural frequencies and mode shapes. Then, the analytical solution was used to estimate the most critical solder joint deformations and stresses. Finally, the so developed solution provided an effective tool to examine the effect of several geometric and material configurations of electronic package structure on the fatigue performance of electronic products under mechanical vibration loadings.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/doi/10.1115/1.4032497/6142523/ep_138_01_011003.pdf

Reference24 articles.

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3. Comparison of Modeling Techniques for the Vibration Analysis of Printed Circuit Cards;ASME J. Electron. Packag.,1992

4. Pitarresi, J. M., and Akanda, A., 1993, “Random Vibration Response of a Surface Mount Lead/Solder Joint,” ASME International Electronics Packaging Conference, Binghamton, NY, Sept. 29–Oct. 2, Vol. 1, pp. 207–215.

5. Pitarresi, J. M., 1990, “Modeling of Printed Circuit Cards Subject to Vibration,” IEEE International Symposium on Circuits and Systems, New Orleans, LA, May 1–3, pp. 2104–2107.

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