Impingement Cooling of Electronics

Abstract

Experiments were conducted to determine the performance of a system of low-velocity air jets used to cool a simulated electronics package. The test model consisted of a uniform array of rectangular elements mounted to a circuit board. Each element was cooled by a cluster of four jets, and the spent fluid was vented at one end of the channel formed between the circuit board and the plate from which the jets were discharged. Reported are measurements of system pressure drop and convective heat transfer coefficients for elements at various sites within the array. Results indicate that (for the geometry tested) the largest portion of the total pressure drop occurs across the jet orifices. Further, the crossflow of spent air appears to enhance heat transfer for those elements near the exit end of the channel.