Dynamic Models of Thermal Systems Using an Energy-Based Modeling Approach

Author:

Grossi Federica1,Zanasi Roberto2

Affiliation:

1. Department of Engineering “Enzo Ferrari,” University of Modena and Reggio Emilia, Modena 41121, Italy e-mail:

2. Professor Department of Engineering “Enzo Ferrari,” University of Modena and Reggio Emilia, Modena 41121, Italy e-mail:

Abstract

The aim of this work is to give a new approach to obtain compact dynamic thermal models suitable for a variety of systems where the heat transfer can be caused by conduction, internal convection (not at the boundary), and evaporation/condensation of water. The structural properties of the proposed dynamic model are presented and discussed in this paper. These properties guarantee conservation of energy and mass within the system, thus giving a good confidence in the correctness of the model. This paper shows that the proposed model has a simple structure, can be easily implemented in simulink, and provides simulation times much shorter compared with those usually obtained using CFD programs. The proposed model proves to be suitable for real-time simulations and for control design purposes.

Publisher

ASME International

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference18 articles.

1. Reduced Order Thermal Models of Multiscale Microsystems;ASME J. Heat Transfer,2012

2. Proper Orthogonal Decomposition for Reduced Order Thermal Modeling of Air Cooled Data Centers;ASME J. Heat Transfer,2010

3. Compact Thermal Models for Electronic Systems;IEEE Trans. Compon. Packag. Technol.,2003

4. Bosch, E., and Sabry, M., 2002, “Thermal Compact Models for Electronic Systems,” 18th Annual IEEESymposium Semiconductor Thermal Measurement and Management, San Jose, CA, Mar. 12–14, Vol. 1, pp. 21–29.10.1109/STHERM.2002.991341

5. Mohamed-Nabil, S., and Hossam, S., 2007, “Compact Thermal Models: A Global Approach,” ASME J. Electron. Packag., 130(4), p. 041107.10.1115/1.2993132

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