Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Cited by
59 articles.
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1. P* Admissible Thermal-Aware Matrix Floorplanner for 3D ICs;2023 IEEE 36th International System-on-Chip Conference (SOCC);2023-09-05
2. Low Computational Cost Thermal Modelling of High-Frequency Power Transformers using an Admittance Matrix Apporach;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30
3. Pareto based Multi-Objective Evolutionary Optimization of Multi-node Network for Thermal Modelling of Electronic Package;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30
4. ARTSim: A Robust Thermal Simulator for Heterogeneous Integration Platforms;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
5. Compact Thermal Modeling of Magnetic Components Using an Admittance Matrix Approach;Heat Transfer Engineering;2023-01-17