Sub-Continuum Simulations of Heat Conduction in Silicon-on-Insulator Transistors
Author:
Affiliation:
1. Department of Mechanical Engineering, Stanford University, Stanford, CA 94305
2. IBM Corporation, Almaden Research Center
Abstract
Publisher
ASME International
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Link
http://asmedigitalcollection.asme.org/heattransfer/article-pdf/123/1/130/5485476/130_1.pdf
Reference36 articles.
1. Majumdar, A. , 1993, “Microscale Heat Conduction in Dielectric Thin Films,” ASME J. Heat Transfer, 115, pp. 7–16.
2. Ju, Y. S., and Goodson, K. E., 1999, “Phonon Scattering in Silicon Films with Thickness of Order 100 nm,” Appl. Phys. Lett., 74, pp. 3005–3007.
3. Lai, J., and Majumdar, A., 1996, “Concurrent Thermal and Electrical Modeling of Sub-Micrometer Silicon Devices,” J. Appl. Phys., 79, pp. 7353–7361.
4. Raha, P., Ramaswamy, S., and Rosenbaum, E., 1997, “Heat Flow Analysis for EOS/ESD Protection Device Design in SOI Technology,” IEEE Trans. Electron Devices, 44, pp. 464–471.
5. Goodson, K. E., Flik, M. I., Su, L. T., Antoniadis, D. A., 1995, “Prediction and Measurement of Temperature Fields in Silicon-on-Insulator Electronic Circuits,” ASME J. Heat Transfer, 117, pp. 574–581.
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