A Model of Contact With Adhesion of a Layered Elastic-Plastic Microsphere With a Rigid Flat Surface

Author:

Eid H.1,Joshi N.1,McGruer N. E.2,Adams G. G.1

Affiliation:

1. Department of Mechanical and Industrial Engineering Northeastern University, Boston, MA 02115

2. Department of Electrical and Computer Engineering Northeastern University, Boston, MA 02115

Abstract

A finite element model of a layered hemisphere contacting a rigid flat, which includes the effect of adhesion, is developed. In this analysis elastic-plastic material properties were used for each of the materials comprising the layered hemisphere. The inclusion of the effect of adhesion, which was accomplished with the Lennard-Jones potential, required a special procedure. This configuration is of general theoretical interest in the understanding of adhesion. It has also been suggested as a possible design for a microswitch contact because, with an appropriate choice of metals, it has the potential to achieve low adhesion, low contact resistance, and high durability. The effect of the layer thickness on the adhesive contact was investigated. In particular the influences of layer thickness on the pull-off force, maximum contact radius, and contact resistance were determined. The results are presented as load versus interference and contact radius versus interference for loading and unloading from different values of the maximum interference.

Publisher

ASME International

Subject

Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanical Engineering,Mechanics of Materials

Reference21 articles.

1. Elastic-Plastic Contact Analysis of a Sphere and a Rigid Flat;Kogut;Journal of Applied Mechanics

2. A Finite Element Study of Elasto-Plastic Hemispherical Contact Against a Rigid Flat;Jackson;ASME Journal of Tribology

3. Surface Energy and the Contact of Elastic Solids;Johnson

4. Effect of Contact Deformations on the Adhesion of Particles;Derjaguin;Journal of Colloid Interface Science

5. Surface Forces and Surface Interactions;Tabor;Journal of Colloid Interface Science

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