Abstract
Recesses created in the lid of a microchannel heat sink can serve to modulate the flow, resulting in local and global heat transfer enhancement. Numerical analysis of laminar flow and heat transfer in such a modified microchannel heat sink has shown an augmentation of heat transfer without an added penalty of increased pressure drop. The presence of the recesses reduces the overall flow friction and thus pressure drop. The flow expansion into the recesses and the subsequent contraction into the downstream region causes significant local enhancement in heat transfer. Both the maximum and average wall temperatures are decreased as a result. The heat transfer is locally enhanced, by as much as 150% in the regions just downstream of the recesses due to the re-initialization of boundary layers as the flow re-enters the microchannels. The potential for hot-spot mitigation in microelectronics devices using this approach is discussed.
Reference7 articles.
1. Tuckerman
D. B.
and PeaseR. F. W., 1981, “Highperformance heat sinking for VLSI,” IEEE Electron Device Letters, Vol. 2, pp. 126–129.
2. Phillips, R. J., 1987, Microchannel Heat Sinks, Ph.D. Thesis, Massachusetts Institute of Technology.
3. Goodling, J. S., 1993, “Microchannel heat exchangers — a review,” Proc. Int. Soc. Opt. Eng., Vol. 1997 High Heat Flux Engineering II, pp. 66–82.
4. Garimella
S. V.
and SobhanC. B., 2003, “Transport in microchannels — A critical review,” Ann. Rev. Heat Transfer, Vol. 13, Chapter 1, pp. 1–50.
5. Lee
P. S.
, GarimellaS. V. and LiuD., 2005, “Investigation of heat transfer in rectangular microchannels,” Int. J. Heat Mass Transfer, Vol. 48, pp. 1688–1704.
Cited by
11 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献