1. Edward, S.
, 1991, “X-Ray Systems Keep Pace with SMT,” Test Meas. World, 11(3), pp. 21–22.
2. Adams, T.
, 1995, “Acoustic Micro Imaging of Flip Chip Interconnects,” III-Vs Review, 8(5), Oct., pp. 50–52.
3. Lau, J. H., and Keely, C. A., 1989, “Dynamic Characterization of Surface-Mount Component Leads for Solder Joint Inspection,” IEEE Trans Surface-Mount Component Leads for Solder Joint Inspection, 12(4), Dec., pp. 594–602.
4. Semmens, J. E., and Kessler, L. W., 1997, “Further Investigation Into the Use of Acoustic Micro Imaging for Analyzing Flip Chip Integrity and Failure Modes,” Proc. SPIE, 6th Int. Conf. and Exhibit. on Multichip, Modules, Denver, CO, February 2–4, pp. 165–169.
5. Liu, S., Erdahl, D., Ume, I. C., and Achari, A., 2000, “A Novel Method and Device for Solder Joint Quality Inspection by Using Laser Ultrasound,” Proc. Electronic Components and Technology Conference, Las Vegas, NV, May.