Thermal Stability of Thermal Interface Pastes, Evaluated by Thermal Contact Conductance Measurement-Reference-Cited by-同舟云学术

Thermal Stability of Thermal Interface Pastes, Evaluated by Thermal Contact Conductance Measurement

Published:2000-06-26 Issue:3 Volume:123 Page:309-311
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Luo, Xiangcheng¹,Xu, and Yunsheng¹,Chung D. D. L.¹

Affiliation:

1. Composite Materials Research Laboratory, State University of New York at Buffalo, Buffalo, NY 14260-4400

Abstract

Thermal interface pastes based on silicone, lithium doped polyethylene glycol (PEG), and sodium silicate were evaluated in their performance before and after heating up to 120°C. The thermal contact conductance of any of the pastes between copper disks decreased after heating, such that the fractional decrease was less for the silicone-based paste than the PEG-based and sodium-silicate-based pastes. Nevertheless, the conductance was lower for the silicone-based paste than the other pastes both before and after heating up to 100 cycles.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/123/3/309/5883354/309_1.pdf

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