Variable-Length Link-Spring Model for Kink Formation During Wire Bonding

Author:

Wang Fuliang1,Tang Weidong,Li Junhui,Han Lei23

Affiliation:

1. e-mail:

2. State Key Laboratory of High Performance Complex Manufacturing, Changsha 410083, China;

3. School of Mechanical and Electrical Engineering, Central South University, Changsha 410083, China

Abstract

Kinks have a strong influence on the structural performance of wire bonds. In this study, a variable-length link-spring model has been developed to better understand kink formation. In this model, a gold wire was decomposed into segments that were represented by a link and a torsional spring. One end of the gold wire was fixed, and the other end was free. The friction and air tension forces at the wire ends were considered a function of the capillary position, and the wire segments and moment balance equations were added at the free end as the wire length increased. By using this model, the wire profile, moment, and curvature diagrams at the reverse motion stage were obtained to study the dynamical kink formation and wire-length increasing processes. The analysis result was verified experimentally. Good agreement is obtained between the analytical and the experimental wire profiles. This study indicates that a moment magnitude of several hundred mN·μm is required to form a kink, and the wire profile is the result of the residual curvature and the instantaneous bending moment.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Reference22 articles.

1. A Method to Determine the Sweep Resistance of Wire Bonds for Microelectronic Packaging;Microelectron. Eng.,2008

2. Shu, B., 1992, “Wire Bond Development for High-Pincount Surface-Mount,” Proceedings 42nd Electronic Components and Technology Conference ('92 ECTC), San Diego, May 18–20, pp. 890–898.10.1109/ECTC.1992.204312

3. Wire Bond Loop Profile Development for Fine Pitch-Long Wire Assembly;IEEE Trans. Semicond. Manuf.,1994

4. Development of New Ultra-High Stiffness Gold Bonding Wire,1999

5. Looping Behaviour of Gold Ballbonding Wire;EPTC 2004,2004

Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3