Thin Film Phonon Heat Conduction by the Dispersion Lattice Boltzmann Method
Author:
Affiliation:
1. Departamento de Ingeniería Mecánica y Metalúrgica, Pontificia Universidad Católica de Chile, Vicuña Mackenna 4860, Macul Santiago, Chile
2. ASME Life Fellow
3. Mechanical Engineering Department, Carnegie Mellon University, Pittsburgh, PA 15213
Abstract
Publisher
ASME International
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Link
http://asmedigitalcollection.asme.org/heattransfer/article-pdf/doi/10.1115/1.2944249/5515300/092402_1.pdf
Reference30 articles.
1. Heat Transfer Regimes in Microstructures;Flik;ASME J. Heat Transfer
2. Microscale Heat Conduction in Dielectric Thin Films;Majumdar;ASME J. Heat Transfer
3. International Technology Roadmap for Semiconductors, ITRS 20053 update (http://public.itrs.net/).
4. Zhang, W., and Fisher, T. S., 2002, “Application of the Lattice-Boltzmann Method to Sub-Continuum Heat Conduction,” ASME Paper No. IMECE2002-32122.
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