Boundary-Condition-Independent Reduced-Order Modeling of Heat Transfer in Complex Objects by POD-Galerkin Methodology: 1D Case Study-Reference-Cited by-同舟云学术

Boundary-Condition-Independent Reduced-Order Modeling of Heat Transfer in Complex Objects by POD-Galerkin Methodology: 1D Case Study

Published:2010-04-01 Issue:6 Volume:132 Page:
ISSN:0022-1481
Container-title:Journal of Heat Transfer
language:en
Short-container-title:

Author:

Raghupathy Arun P.¹,Ghia Urmila¹,Ghia Karman¹,Maltz William²

Affiliation:

1. Computational Fluid Dynamics Research Laboratory, University of Cincinnati, Cincinnati, OH 45221-0072

2. Electronic Cooling Solutions, Inc., Mountain View, CA 94043

Abstract

This technical note presents an introduction to boundary-condition-independent reduced-order modeling of complex electronic components using the proper orthogonal decomposition (POD)-Galerkin approach. The current work focuses on how the POD methodology can be used along with the finite volume method to generate reduced-order models that are independent of their boundary conditions. The proposed methodology is demonstrated for the transient 1D heat equation, and preliminary results are presented.

Publisher

ASME International

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

http://asmedigitalcollection.asme.org/heattransfer/article-pdf/doi/10.1115/1.4000945/5563981/064502_1.pdf

Reference11 articles.

1. A Novel Approach for the Thermal Characterization of Electronic Parts;Lasance

2. Flexible Profile Compact Thermal Models for Practical Geometries;Sabry;ASME J. Electron. Packag.

3. Multi-Point Moment Matching Reduction of Distributed Thermal Networks;Codecasa

4. Model Reduction for Power Electronics Systems With Multiple Heat Sources;Augustin

5. Creating Compact Models of Complex Electronic Systems: An Overview and Suggested Use of Existing Model Reduction and Experimental System Identification Tools;Shapiro;IEEE Trans. Compon. Packag. Technol.

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