Affiliation:
1. Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China
Abstract
Instead of the classic Fourier equation based on diffusion, a hyperbolic equation based on a wave model has been used to predict the rapid transient heat conduction in IC chips. The peak temperature, spatial difference, and time variation of temperature, which are critical to thermal reliability of the chip, are given and compared with that obtained from the Fourier equation. Analytical and numerical results show that non-Fourier effects, including the higher peak temperature and thermal stress, greater temperature difference between components, and stronger thermal noise, are significant to IC chip reliability.
Subject
Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials
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