Design for Disassembly With High-Stiffness Heat-Reversible Locator-Snap Systems

Author:

Shalaby Mohammed1,Saitou Kazuhiro1

Affiliation:

1. Department of Mechanical Engineering, University of Michigan, Ann Arbor, MI 48109-2125

Abstract

Recent legislative and social pressures have driven manufacturers to consider effective part reuse and material recycling at the end of product life at the design stage. One of the key considerations is to design and use joints that can disengage with minimum labor, part damage, and material contamination. This paper presents a unified method to design a high-stiffness reversible locator-snap system that can disengage nondestructively with localized heat, and its application to external product enclosures of electrical appliances. The design problem is posed as an optimization problem to find the locations, numbers, and orientations of locators and snaps as well as the number, locations, and sizes of heating areas, which realize the release of snaps with minimum heating area and maximum stiffness while satisfying any motion and structural requirements. The screw theory is utilized to precalculate a set of feasible orientations of locators and snaps, which are examined during optimization. The optimization problem is solved using the multi-objective genetic algorithm coupled with the structural and thermal finite element analysis. The method is applied to a two-piece enclosure of a DVD player with a T-shaped mating line. The resulting Pareto-optimal solutions exhibit alternative designs with different trade-offs between the structural stiffness during snap engagement and the area of heating for snap disengagement. Some results require the heating of two areas at the same time, demonstrating the idea of a lock-and-key.

Publisher

ASME International

Subject

Computer Graphics and Computer-Aided Design,Computer Science Applications,Mechanical Engineering,Mechanics of Materials

Reference30 articles.

1. Design for Assembly and Disassembly;Boothroyd;CIRP Ann.

2. A Key Issue in Product Life Cycle: Disassembly;Jovane;CIRP Ann.

3. Sustainable Development by Design: Review of Life Cycle Design and Other Approaches;Keoleian;Air Waste

4. Issues in Environmentally Conscious Manufacturing and Product Recovery: A Survey;Gungor;Comput. Ind. Eng.

5. Koch, P. , “Snap Fit Design,” The Pennsylvania State University, Eire, PA, http://engr.bd.psu.edu/pkoch/plasticdesign/snap_design.htm.

Cited by 26 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Sökülebilir Yapı Elemanlarının Tekrar Kullanımının Önündeki Engeller ve Yapılması Gerekenler;Tasarım Mimarlık ve Mühendislik Dergisi;2024-07-16

2. Design and analysis of serviceable cantilever fit snap in automotive plastic parts;World Journal of Engineering;2024-02-13

3. Experimental Analysis on Retention Forces of Cantilever Hook Snap-Fits;Lecture Notes in Networks and Systems;2024

4. Dialogue in coexistent formation in the temporal and spatial dimensions / existing hospitals, an applied case;2023 16th International Conference on Developments in eSystems Engineering (DeSE);2023-12-18

5. BIM for deconstruction: A review and bibliometric analysis;Journal of Building Engineering;2023-08

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3