1. Leoni, N., and Amon, C., 1997, “Transient Thermal Design of Wearable Computers with Embedded Electronics Using Phase Change Materials,” ASME HTD-Vol. 343, pp. 49–56.
2. Wirtz, R. A., Zheng, N., and Chandra, D., 1999, “Thermal Management Using “Dry” Phase Change Materials,” Proceedings IEEE Semiconductor Thermal Measurement and Management Symposium, pp. 74–82.
3. Fossett, A. J., Maguire, M. T., Kudirka, A. A., Mills, F. E., and Brown, D. A., 1998, “Avionics Passive Cooling With Microencapsulated Phase Change Materials,” ASME J. Electron. Packag., 120(3), pp. 238–242.
4. Hale, D. V., Hoover, M. J., and O’Neill, M. J., 1971, “Phase Change Materials Handbook,” NASA technical report 72N1995-6.
5. Chandra, D., Barrett, C. S., and Benson, D. K., 1988, “X-Ray Diffraction Studies of Solid Solutions of Pentaglycerine-Neopentylglycol,” Adv. X-Ray Anal., 32, pp. 609–616.