Avionics Passive Cooling With Microencapsulated Phase Change Materials-Reference-Cited by-同舟云学术

Avionics Passive Cooling With Microencapsulated Phase Change Materials

Published:1998-09-01 Issue:3 Volume:120 Page:238-242
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Fossett A. J.¹,Maguire M. T.¹,Kudirka A. A.²,Mills F. E.²,Brown D. A.³

Affiliation:

1. Frisby Technologies, Inc., 4520 Hampton Road, Clemmons, NC 27012

2. Lockheed Martin Skunk Works, Department 25/22, Building 611, Plant 10, 1011 Lockheed Way, Palmdale, CA 93599-2522

3. Wright Laboratory, Wright Patterson Air Force Base, 2130 Eighth Street, Wright-Patterson AFB, OH 45433-7542

Abstract

Analysis for an avionics application typical of remotely located, intermittently operated avionics on aircraft and missiles show that a large weight reduction (about 9:1) can be obtained by using recently developed microencapsulated phase change materials technology instead of a solid aluminum plate for a passive heat sink. Tests with a configuration based on the typical avionics application used for analysis show good agreement with analysis. Use of microencapsulated rather than bulk phase change materials avoids a number of design problems previously encountered with application of such materials.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/120/3/238/5882036/238_1.pdf

Reference8 articles.

1. Colvin, D. P., and Mulligan, J. C., 1990, “Method of Using a PCM Slurry to Enhance Heat Transfer in Liquids,” U.S. Patent 4911232, March 27, 1990.

2. Duffy, V., 1970, “Thermal Control Though Fusible Materials,” Electronic Packaging and Production, July, pp. 45–53.

3. Hale, D. V., Hoover, M. J., and O’Neill, M. J., 1971, Phase Change Materials Handbook, NASA CR-61363.

4. Leoni, M., and Amon, C. H., 1997a, “Thermal Design for Transient Operation of the TIA Wearable Portable Computer,” Thermal Management: Design ASME INTERpack ’97 Conference, Vol. 2, pp. 2151–2161.

5. Leoni, M., and Amon, C. H., 1997b, “Transient Thermal Design of Wearable Computers With Embedded Electronics Using Phase Change Materials,” Thermal Management of Hand-Held, Wearable and Portable Electronics ASME National Heat Transfer Conference, Vol. 5, pp. 49–56.

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