Predicted Fundamental Vibration Frequency of a Heavy Electronic Component Mounted on a Printed Circuit Board

Author:

Suhir Ephraim1

Affiliation:

1. Bell Laboratories, Lucent Technologies, Inc., Physical Sciences and Engineering Research Division, 600 Mountain Avenue, Murray Hill, NJ 07974

Abstract

External electric leads, soldered into plated through-holes (PTHs) of printed circuit boards (PCBs), provide, in addition to electrical interconnection, mechanical support for heavy electronic components (such as, say, power ones) mounted on the boards. The leads can possibly break (most likely by fatigue), if the PCB support contour is subjected to excessive oscillations. Such oscillations typically occur at the lowest resonant frequency (fundamental frequency). The ability to predict this frequency and possibly avoid resonance conditions is of obvious practical importance. Accordingly, in this analysis, we develop a simple formula for the evaluation of the fundamental vibration frequency of a heavy electronic component mounted on a PCB. The formula is obtained for the case, when the component has only one row of leads, and the vibrations occur in the direction of the least flexural rigidity of this row. [S1043-7398(00)00601-0]

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Reference19 articles.

1. Steinbeg, D. S., 1973, Vibration Analysis for Electronic Equipment, Wiley, New York.

2. Markstein, H. W., 1987, “Designing Electronics for High Vibration and Shock,” Electron. Packag. Prod., April, pp. 40–43.

3. Markstein, H. W. , 1989, “Dealing with Vibration in Electronics,” Electron. Packag. Proc., 29, No. 6, pp. 30–34.

4. Suhir, E., and Lee, Y. C., 1990, “Thermal, Mechanical and Environmental Durability Design Methodologies in Electronic Packaging,” in Handbook of Electronic Materials, ASM International.

5. Suhir, E. , 1992, “Nonlinear Dynamic Response of a Flexible Thin Plate to Constant Acceleration Applied to its Support Contour, With Application to Printed Circuit Boards Used in Avionics Packaging,” Int. J. Solids Struct., 29, No. 1, pp. 41–55.

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