1. Steinbeg, D. S., 1973, Vibration Analysis for Electronic Equipment, Wiley, New York.
2. Markstein, H. W., 1987, “Designing Electronics for High Vibration and Shock,” Electron. Packag. Prod., April, pp. 40–43.
3. Markstein, H. W.
, 1989, “Dealing with Vibration in Electronics,” Electron. Packag. Proc., 29, No. 6, pp. 30–34.
4. Suhir, E., and Lee, Y. C., 1990, “Thermal, Mechanical and Environmental Durability Design Methodologies in Electronic Packaging,” in Handbook of Electronic Materials, ASM International.
5. Suhir, E.
, 1992, “Nonlinear Dynamic Response of a Flexible Thin Plate to Constant Acceleration Applied to its Support Contour, With Application to Printed Circuit Boards Used in Avionics Packaging,” Int. J. Solids Struct., 29, No. 1, pp. 41–55.