Transient Thermal Management of a Handset Using Phase Change Material (PCM)-Reference-Cited by-同舟云学术

Transient Thermal Management of a Handset Using Phase Change Material (PCM)

Published:2002-12-01 Issue:4 Volume:124 Page:419-426
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Hodes Marc¹,Weinstein Randy D.²,Pence Stephen J.²,Piccini Jason M.²,Manzione Lou¹,Chen Calvin¹

Affiliation:

1. Bell Laboratories, Lucent Technologies, Murray Hill, NJ 07974

2. Chemical Engineering Department, Villanova University, Villanova, PA 19085

Abstract

The power density of portable electronic devices continues to increase because packaging advances reduce their size even as features are added and enhanced. Designing thermal management systems to accommodate steady-state conditions as opposed to fixed duty cycles can substantially increase cost, size, and weight. The feasibility of transient thermal management of handsets using phase change materials (PCMs) was experimentally investigated using an ABS handset mock-up. At selected intervals of time, the nonuniform case temperature of the handset was measured using an infrared (IR) camera, while thermocouples measured the temperatures of the PCM and simulated power amplifier (heater). Transient and steady-state heat transfer rates by natural convective and radiation from the handset to the environment were numerically computed from the temperature data in the thermal images. The effects of PCM material, power supplied to the handset, and handset orientation on the time required for the handset case to reach a given (maximum) temperature and “recovery” time were examined.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/124/4/419/5883696/419_1.pdf

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