1. Thermal management of graphene-induced high-power semiconductor laser package with bidirectional conduction structure;Wang;Opt. Laser Technol.,2021
2. Y. Weibin, W. Yanchen, W. Jing, D. Yi, L. Jiangwen, Y. Daoguo, Simulation study on thermal characteristics and thermal stress of semiconductor laser package, 2020 21st International Conference on Electronic Packaging Technology (ICEPT), (2020) 5 pp.-5 pp. 10.1109/ICEPT50128.2020.9202894.
3. W. Yun-Long, C. Sheng-Ping, Numerical simulation of thermal distribution in quasi-heatcapacity fiber lasers, IOP Conference Series: Earth and Environmental Science, 565 (2020) 012012 (012018 pp.)-012012 (012018 pp.). 10.1088/1755-1315/565/1/012012.
4. High performance and subambient silicon microchannel cooling;Colgan;J. Heat Transf. Trans. Asme,2007
5. Investigation of heat transfer in rectangular microchannels;Lee;Int. J. Heat Mass Transf.,2005