Rack Level Modeling of Air Flow Through Perforated Tile in a Data Center

Author:

Arghode Vaibhav K.1,Kumar Pramod2,Joshi Yogendra3,Weiss Thomas,Meyer Gary4

Affiliation:

1. Post-Doctoral Fellow George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332 e-mail:

2. Department of Mechanical Engineering, Indian Institute of Science, Bangalore, Kamataka 560012, India

3. George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332

4. Triad Floors, Inc., Denver, CO 80202

Abstract

Effective air flow distribution through perforated tiles is required to efficiently cool servers in a raised floor data center. We present detailed computational fluid dynamics (CFD) modeling of air flow through a perforated tile and its entrance to the adjacent server rack. The realistic geometrical details of the perforated tile, as well as of the rack are included in the model. Generally, models for air flow through perforated tiles specify a step pressure loss across the tile surface, or porous jump model based on the tile porosity. An improvement to this includes a momentum source specification above the tile to simulate the acceleration of the air flow through the pores, or body force model. In both of these models, geometrical details of tile such as pore locations and shapes are not included. More details increase the grid size as well as the computational time. However, the grid refinement can be controlled to achieve balance between the accuracy and computational time. We compared the results from CFD using geometrical resolution with the porous jump and body force model solution as well as with the measured flow field using particle image velocimetry (PIV) experiments. We observe that including tile geometrical details gives better results as compared to elimination of tile geometrical details and specifying physical models across and above the tile surface. A modification to the body force model is also suggested and improved results were achieved.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Reference16 articles.

1. Airflow and Cooling in a Data Center;ASME J. Heat Transfer,2010

2. A Methodology for the Design of Perforated Tiles in Raised Floor Data Centers Using Computational Flow Analysis;IEEE Trans. Compon. Packag. Technol.,2001

3. Airflow Distribution Through Perforated Tiles in Raised-Floor Data Centers, Building and Environment;Build. Environ.,2006

4. Schmidt, R. R., Karki, K. C., Kelkar, K. M., Radmehr, A., and Patankar, S. V., 2001, “Measurements and Predictions of the Flow Distribution Through Perforated Tiles in Raised-Floor Data Centers,” Pacific Rim/ASME International Electronic Packaging Technical Conference and Exhibition, Kauai, HI, July 8–13, ASME Paper No. IPACK2001-15728.

5. Convective Transport Process in Data Centers;Numer. Heat Transfer, Part A,2006

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