Airflow and Cooling in a Data Center

Author:

Patankar Suhas V.1

Affiliation:

1. Department of Mechanical Engineering, University of Minnesota, Minneapolis, MN 55455; President inInnovative Research, Inc., Plymouth, MN 55447

Abstract

This paper deals with the distribution of airflow and the resulting cooling in a data center. First, the cooling challenge is described and the concept of a raised-floor data center is introduced. In this arrangement, cooling air is supplied through perforated tiles. The flow rates of the cooling air must meet the cooling requirements of the computer servers placed next to the tiles. These airflow rates are governed primarily by the pressure distribution under the raised floor. Thus, the key to modifying the flow rates is to influence the flow field in the under-floor plenum. Computational fluid dynamics (CFD) is used to provide insight into various factors affecting the airflow distribution and the corresponding cooling. A number of ways of controlling the airflow distribution are explored. Then attention is turned to the above-floor space, where the focus is on preventing the hot air from entering the inlets of computer serves. Different strategies for doing this are considered. The paper includes a number of comparisons of measurements with the results of CFD simulations.

Publisher

ASME International

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

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