Simulation of Void Growth in Molten Solder Bumps-Reference-Cited by-同舟云学术

Simulation of Void Growth in Molten Solder Bumps

Published:2003-09-01 Issue:3 Volume:125 Page:329-334
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Panton Ronald L.¹,Lee Jong W.¹,Goenka Lakhi²,Achari Achyuta²

Affiliation:

1. Mechanical Engineering Department, University of Texas, Austin, TX

2. Visteon, Electronics Technical Center, Dearborn, MI

Abstract

This research studies the motion of void bubbles within molten solder bumps. Surface tension variation on the outer surface of the bump drives a flow that is transmitted to the interior by viscosity. Bubbles inside the bump grow by collisions with other bubbles. A computer model of this process has been formulated. In cases with the melting process from top to bottom, a ring of bubbles collected at the top outer rim of the solder bump. When the melting direction was reversed, the typical result was a single large bubble near the center with a few smaller recirculating bubbles.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/125/3/329/5883456/329_1.pdf

Reference6 articles.

1. Chan, Y. C., Xie, D. J., and Lai, J. K. L., 1996, “Experimental Studies of Pore Formation in Surface Mount Solder Joints,” Mater. Sci. Eng., B, 38(1–2), p. 5353.

2. Goenka, L. N., and Achari, A., 1995, “Void Formation in Flip-Chip Solder Bumps: Part I,” 18th IEEE/CHMT Symposium, Austin TX.

3. Goenka, L. N., and Achari, A., 1996, “Void Formation in Flip-Chip Solder Bumps: Part II,” Nineteenth IEEE/CHMT Symposium, Austin TX.

4. Vural, C., 1998, private communication.

5. Davis, A. M. J. , 1989, “Thermocapillary Convection in Liquid Bridges: Solution Structure and Eddy Motions,” Phys. Fluids A, 1, p. 479479.

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