Testing and Modeling of Solders Using New Test Device, Part 1: Models and Testing
Author:
Affiliation:
1. Copeland Corporation, P.O. Box 669, Sidney, OH 45365-0667
2. Department of Civil Engineering and Engineering Mechanics, The University of Arizona, Tucson, AZ 85721-0072
Publisher
ASME International
Subject
Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials
Link
http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/126/2/225/5692451/225_1.pdf
Reference27 articles.
1. Desai, C. S., and Whitenack, R., 2001, “Review of Models and the Disturbed State Concept for Thermomechanical Analysis in Electronic Packaging,” ASME J. Electron. Packag., 123, pp. 1–15.
2. Desai, C. S., 2001, Mechanics of Materials and Interfaces: The Disturbed State Concept, CRC Press, Boca Raton, Florida, USA.
3. Desai, C. S., Chia, J., Kundu, T., and Prince, J. L., 1997, “Thermomechanical Response of Materials and Interfaces in Electronic Packaging: Part I and II,” ASME J. Electron. Packag., 119, pp. 209–300.
4. Desai, C. S., Basaran, C., Dishongh, T., and Prince, J. L., 1998, “Thermomechanical Analysis in Electronic Packaging with Unified Constitutive Model for Materials and Joints,” IEEE Trans. Compon., Packag. Manuf. Technol., Part B, 12(1), pp. 87–97.
5. Perzyna, P. , 1966, “Fundamental Problems in Viscoplasticity,” Recent Advances in Appl. Mechanics, 9, pp. 243–277.
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