Jet Impingement Cooling of Chips Equipped With Multiple Cylindrical Pedestal Fins

Author:

Lee D. H.1,Chung Y. S.2,Ligrani P. M.3

Affiliation:

1. School of Mechanical and Automotive Engineering, Inje University, 607 Obang-dong, Gimhae, Gyongnam 621-749 Korea

2. Samsung Electronics Co., Ltd., 416, Maetan3-dong, Paldal-gu, Suwon, Gyeonggi-do 442-742, Korea

3. Donald Schultz Professor of Turbomachinery, Director, Thermo-Fluids Laboratory, Department of Engineering Science, Oxford University, Parks Road, Oxford OX1 3PJ, United Kingdom

Abstract

Fluid flow and heat transfer characteristics on and around a central pedestal and a secondary pedestal, mounted on a flat surface with an impinging jet, are investigated. Surface Nusselt numbers, pressure coefficients (in the form of normalized wall static pressure relative to freestream static pressure), and flow visualization results are given for jet Reynolds numbers of 23,000 and 2300. The dimensionless nozzle-to-surface distance L∕d is 2, and the nondimensional height of the central pedestal H∕D is 0.5. Results are given for different secondary pedestal heights and locations. Spatially averaged Nusselt numbers measured with secondary pedestals employed are 13% to 33% higher than values measured with no secondary pedestal. Local Nusselt numbers and wall pressure coefficients, measured with the secondary pedestal present, are different from values measured with no secondary pedestal, because of flow reattachment and the two counter-rotating recirculation zones located between the two pedestals, and small local regions of flow separation and recirculation located on top of the secondary pedestal. As such, the present multiple pedestal data with impinging jets are useful for a variety of electronics cooling arrangements.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Reference20 articles.

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3. Single-Phase and Boiling Cooling of Small Pin Fin Arrays of Multiple Nozzle Jet Impingement;Copeland;ASME J. Electron. Packag.

4. Heat Transfer From Pin-Fins Situated in an Oncoming Longitudinal Flow Which Turns to Crossflow;Sparrow;Int. J. Heat Mass Transfer

5. Wadsworth, D. C. , 1989, “Cooling of a Multichip Electronic Module by Means of Confined Two-Dimensional Jets of Dielectric Liquid,” MS thesis, Purdue University, West Lafayette, IN.

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