Affiliation:
1. Philips Research Laboratories, Eindhoven 5656AE, The Netherlands
Abstract
The nontrivial issues associated with calculating the steady state heat spreading effects generated by a heat source on top of a multilayer assembly such as a printed circuit board are discussed. It is argued that problems arise with the interpretation of heat spreading effects due to a misconception about the meaning of often-quoted flux limits and especially the physical meaning of thermal resistance. The usefulness of a number of approaches that are generally in use to analyze heat spreading effects is discussed and it is shown that the popular series-resistance approach has severe limitations. A number of test cases are covered in detail and the results testify to this assertion.
Subject
Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials
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