Thermal Resistance of a Two Dimensional Flux Channel with Eccentric Heat Source and Asymmteric Edge Cooling-Reference-Cited by-同舟云学术

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Thermal Resistance of a Two Dimensional Flux Channel with Eccentric Heat Source and Asymmteric Edge Cooling

Published:2024-04-07 Issue: Volume:6 Page:1-9
ISSN:
Container-title:2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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Author:

Razavi M.¹,Muzychka Y.S.²,Kocabiyik S.³

Affiliation:

1. New York Institute of Technology,Department of Energy Management,Vancouver,BC,Canada,V5M 4X5

2. Memorial University of Newfoundland,Faculty of Engineering and Applied Science,St. John’s,NL,Canada,A1B 3X5

3. Memorial University of Newfoundland,Department of Mathematics and Statistics,St. John’s,NL,Canada,A1C 5S7

Funder

Natural Sciences and Engineering Research Council of Canada

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10491281/10491408/10491553.pdf?arnumber=10491553

Reference23 articles.

1. COMSOL Multiphysics Version 4.0 released

2. Spreading Resistance of Isoflux Rectangles and Strips on Compound Flux Channels

3. The Thermal Design of an LSI Single-Chip Package

4. Maximum thermal spreading resistance for rectangular sources and plates with nonunity aspect ratios

5. Analytical Solution of Thermal Spreading Resistance in Power Electronics

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