Analytical and Numerical Simulation of Ultrasonic Assisted Grinding

Abstract

Ultrasonic assisted grinding of hard materials is a novel technique which is used in order to decrease grinding forces and energy. Grinding force is in direct connection with wheel wear, grinding accuracy, grinding temperature and surface integrity. In this paper the effects of ultrasonic vibration in creep feed grinding process which is superimposed to the workpiece in feed direction has been represented. The mechanism of grain-workpiece interaction in the presence of ultrasonic vibration has been investigated both analytically and numerically. The cutting path of a single grain in ultrasonic assisted grinding has been derived using equations of motion and has been compared to the grain cutting path in ordinary grinding. Using displacement equations of a single grain in ultrasonic assisted grinding and drawing the motion path, it has been shown that there exist a multiple-impact between grain and workpiece. By implementing a 2-D finite element modeling, the mechanism of chip formation in ultrasonic assisted grinding and ordinary grinding has been compared. Furthermore the effects of longitudinal workpiece vibration on the grinding forces have been investigated. FE analysis of grain-workpiece interaction in case of using ultrasonic vibration has shown a reduction of about 40% of grinding forces compared to ordinary grinding.