Development and Validation of a Transient Heat Transfer Model for Evaluating Thermal Management Solutions for Packaging Next-Generation Smart City Infrastructure Devices

Author:

Dey Shuv1,Jimenez Luis Diego Monge1,Brown J. Michael2,Joshi Yogendra1

Affiliation:

1. G. W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology , Atlanta, GA 30332

2. Mechanical Engineering, Manufacturing Resources International , Alpharetta, GA 30005

Abstract

Abstract Outdoor digital displays have become increasingly popular and common for smart city applications, and more recently provides a concealment solution and integration point for outdoor communications devices meant to be attached to buildings, street lamps, or traffic poles. Given the larger energy requirements for powering next generation 5G cellular networks, these devices create unique difficulties in developing and evaluating thermal management solutions. The present study develops and validates the extreme condition transient (ECT) climate model using a computational fluid dynamics/heat transfer numerical model, to evaluate diurnal thermal responses from a representative 5G small cell devices. The model is validated for local conditions present in Atlanta, GA for two unique days. The thermal response from the ECT climate model is presented alongside three real case study locations, Miami, FL, New York, NY, and Phoenix, AZ.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

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