1. Han, S., 1994. “A Study on Plastic Encapsulation of Semiconductor Chips,” Cornell Injection Molding Program Technical Report No. 77.
2. Han, S., and Wang, K. K., 1993. “Analysis of Wire Sweep Related to Encapsulation of Semiconductor Chips,” Chap. X, CIMP Progress Report No. 17.
3. Han, S., and Wang, K. K., 1993. “A Study on the Effects of Fillers on Wire Sweep Related to Semiconductor Chip Encapsulation,” ASME Winter Annual Meeting.
4. Han, S., and Wang, K. K., 1995. “Flow Analysis in a Cavity with Leadframe during Semiconductor Chip Encapsulation,” Advances in Electronic Packaging ASME EEP-Vol. 10-1.
5. C-MOLD Reactive Molding and Microchip Encapsulation Training Guide, C-MOLD Pacific.