Failure Analysis of Direct Liquid Cooling System in Data Centers

Author:

Alkharabsheh Sami1,Puvvadi Udaya L. N.2,Ramakrishnan Bharath3,Ghose Kanad2,Sammakia Bahgat3

Affiliation:

1. Department of Mechanical Engineering, Binghamton University, Binghamton, NY 13902 e-mail:

2. Department of Computer Science, Binghamton University, Binghamton, NY 13902

3. Department of Mechanical Engineering, Binghamton University, Binghamton, NY 13902

Abstract

In this paper, the impact of direct liquid cooling (DLC) system failure on the information technology (IT) equipment is studied experimentally. The main factors that are anticipated to affect the IT equipment response during failure are the central processing unit (CPU) utilization, coolant set point temperature (SPT), and the server type. These factors are varied experimentally and the IT equipment response is studied in terms of chip temperature and power, CPU utilization, and total server power. It was found that failure of this cooling system is hazardous and can lead to data center shutdown in less than a minute. Additionally, the CPU frequency throttling mechanism was found to be vital to understand the change in chip temperature, power, and utilization. Other mechanisms associated with high temperatures were also observed such as the leakage power and the fans' speed change. Finally, possible remedies are proposed to reduce the probability and the consequences of the cooling system failure.

Funder

National Science Foundation

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Reference24 articles.

1. Energy Consumption of Information Technology Data Centers;J. Electron. Cool.,2010

2. United States Data Center Energy Usage Report,2016

3. Uptime Institute 2012 Data Center Industry Survey,2013

4. A Brief Overview of Recent Developments in Thermal Management in Data Centers;ASME J. Electron. Packag.,2015

5. Improving Data Center Energy Efficiency With Advanced Thermal Management;IEEE Trans. Compon. Packag. Manuf. Technol.,2017

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