Failure Analysis of Direct Liquid Cooling System in Data Centers

Author:

Alkharabsheh Sami1,Puvvadi Udaya L. N.2,Ramakrishnan Bharath3,Ghose Kanad2,Sammakia Bahgat3

Affiliation:

1. Department of Mechanical Engineering, Binghamton University, Binghamton, NY 13902 e-mail:

2. Department of Computer Science, Binghamton University, Binghamton, NY 13902

3. Department of Mechanical Engineering, Binghamton University, Binghamton, NY 13902

Abstract

In this paper, the impact of direct liquid cooling (DLC) system failure on the information technology (IT) equipment is studied experimentally. The main factors that are anticipated to affect the IT equipment response during failure are the central processing unit (CPU) utilization, coolant set point temperature (SPT), and the server type. These factors are varied experimentally and the IT equipment response is studied in terms of chip temperature and power, CPU utilization, and total server power. It was found that failure of this cooling system is hazardous and can lead to data center shutdown in less than a minute. Additionally, the CPU frequency throttling mechanism was found to be vital to understand the change in chip temperature, power, and utilization. Other mechanisms associated with high temperatures were also observed such as the leakage power and the fans' speed change. Finally, possible remedies are proposed to reduce the probability and the consequences of the cooling system failure.

Funder

National Science Foundation

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Reference24 articles.

1. Energy Consumption of Information Technology Data Centers;J. Electron. Cool.,2010

2. United States Data Center Energy Usage Report,2016

3. Uptime Institute 2012 Data Center Industry Survey,2013

4. A Brief Overview of Recent Developments in Thermal Management in Data Centers;ASME J. Electron. Packag.,2015

5. Improving Data Center Energy Efficiency With Advanced Thermal Management;IEEE Trans. Compon. Packag. Manuf. Technol.,2017

Cited by 12 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3