On the Use of the Hole-Drilling Technique for Residual Stress Measurements in Thin Plates
Author:
Affiliation:
1. Test Engineering and Analysis Branch, NASA Ames Research Center, Moffett Field, CA 94035
2. Mechanical Engineering Department, Stanford University, Stanford, CA 94305-4021
Abstract
Publisher
ASME International
Subject
Mechanical Engineering,Mechanics of Materials,Safety, Risk, Reliability and Quality
Link
http://asmedigitalcollection.asme.org/pressurevesseltech/article-pdf/114/3/292/5518920/292_1.pdf
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3. Numerical and experimental investigation of thickness effect on residual stress measurement;Materials Science and Technology;2016-03-10
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5. On the Improvement of Calibration Coefficients for Hole-Drilling Integral Method: Part I—Analysis of Calibration Coefficients Obtained by a 3-D FEM Model;Journal of Engineering Materials and Technology;2002-03-26
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