Numerical Analysis of Metal Cutting With Chamfered and Blunt Tools

Author:

Movahhedy, M. R.1,Altintas, Y.2,Gadala, M. S.2

Affiliation:

1. Department of Mechanical Engineering, Sharif University of Technology, Tehran, Iran

2. Department of Mechanical Engineering, The University of British Columbia, 2324 Main Mall, Vancouver, Canada

Abstract

In high speed machining of hard materials, tools with chamfered edge and materials resistant to diffusion wear are commonly used. In this paper, the influence of cutting edge geometry on the chip removal process is studied through numerical simulation of cutting with sharp, chamfered or blunt edges and with carbide and CBN tools. The analysis is based on the use of ALE finite element method for continuous chip formation process. Simulations include cutting with tools of different chamfer angles and cutting speeds. The study shows that a region of trapped material zone is formed under the chamfer and acts as the effective cutting edge of the tool, in accordance with experimental observations. While the chip formation process is not significantly affected by the presence of the chamfer, the cutting forces are increased. The effect of cutting speed on the process is also studied.

Publisher

ASME International

Subject

Industrial and Manufacturing Engineering,Computer Science Applications,Mechanical Engineering,Control and Systems Engineering

Reference28 articles.

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2. Armarego, E. J. A., 1993, Material Removal Processes—An Intermediate Course, University of Melbourne, Australia.

3. Arsecularatne, J. A. , 1997, “On Tool-Chip Interface Stress Distributions, Ploughing Force and Size Effect in Machining,” Int. J. Mach. Tools Manuf., 37, pp. 885–899.

4. Waldorf, D. J., DeVor, R. E., and Kapoor, S. G., 1997, “A Slip-line Field for Ploughing During Orthogonal Cutting,” Proceedings of ASME Int. Mechanical Engineering Congress and Exposition, MED 6-1, pp. 121–128.

5. Stevenson, R., and Stephenson, D. A., 1995, “The Mechanical Behavior of Zinc During Machining,” ASME J. Eng. Mater. Technol., 117, pp. 172–178.

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