Affiliation:
1. Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801
Abstract
Failures of solder joints often result from development of cracks under complex mixed-mode loading conditions. In this study, a flexural peel technique was developed to investigate the growth of cracks at the interface between solder and Cu substrate. The technique was based on a tri-layer solder/Cu joints, with the solder layer sand-wiched between two Cu layers of desired thicknesses. Finite element analysis was used to calculate the mixed-mode condition at the crack tip as a function of the thicknesses of Cu outerlayers and the solder interlayer. The application of this technique to studying interface crack growth under fatigue loading is demonstrated for eutectic solder joints.
Subject
Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials
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