Fatigue Life of Sn3.0Ag0.5Cu Solder Alloy Under Combined Cyclic Shear and Constant Tensile/Compressive Loads

Author:

Dale Travis1,Singh Yuvraj1,Bernander Ian1,Subbarayan Ganesh1,Handwerker Carol2,Su Peng3,Glasauer Bernard3

Affiliation:

1. School of Mechanical Engineering, Purdue University, West Lafayette, IN 47907

2. School of Materials Engineering, Purdue University, West Lafayette, IN 47907

3. Juniper Networks, Sunnyvale, CA 94089

Abstract

Abstract Solder joints in electronic assemblies experience damage due to cyclic thermomechanical loading that eventually leads to fatigue fracture and electrical failure. While solder joints in smaller, die-sized area-array packages largely experience shear fatigue due to thermal expansion mismatch between the component and the substrate, larger area-array packages experience a combination of cyclic shear and axial tensile/compressive loads due to flexure of the substrate. Additionally, on larger processor packages, the attachment of heatsinks further exacerbates the imposed axial loads, as does package warpage. With the increase in size of packages due to 2.5D heterogeneous integration, the above additional axial loads can be significant. Thus, there exists a critical need to understand the impact on fatigue life of solder joints with superposed compressive/tensile loads on the cyclic shear loads. In this paper, we describe a carefully constructed multi-axial microprecision mechanical tester as well as fatigue test results on Sn3.0Ag0.5Cu (SAC305) solder joints subjected to controlled cyclic shear and constant compressive/tensile loads. The tester design allows one to apply cyclic shear loads up to 200 N while maintaining a constant axial load of up to 38 N in tension or compression. The tester is capable of maintaining the axial load to within a tolerance of ±0.5 N during the entirety of fatigue experiment. Carefully constructed test specimens of Sn3.0Ag0.5Cu solder joints were isothermally fatigued under systematically increased compressive and tensile loads imposed on the test specimen subject to repeated loading (R = 0) under lap-shear. In general, the imposition of the superposed compressive load increases the fatigue life of the solder joint compared to application of pure cyclic shear, while the imposition of the superposed tensile load decreases the fatigue life. At larger compressive loads, friction between fractured surfaces is responsible for significant energy dissipation during the cyclic load–unload cycles.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Reference15 articles.

1. Tucker, J. P., 2012, “ Microstructural Effects on Constitutive and Fatigue Fracture Behavior of TinSilverCopper Solder,” Ph.D. thesis, Purdue University, Purdue, IN.https://ui.adsabs.harvard.edu/abs/2012PhDT.......163T/abstract

2. Solder Joint Reliability-Theory and Applications;ASME J. Electron. Packag.,1992

3. A Mechanism for Board Warpage by Thermal Expansion of Surface Mounted Connector;IEEE Trans. Compon., Hybrids, Manuf. Technol.,1986

4. Effect of Compression Loads on the Solder Joint Reliability of Flip Chip BGA Packages,2004

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