Analytical Solutions of Heat Transfer and Film Thickness in Thin-Film Evaporation-Reference-Cited by-同舟云学术

Analytical Solutions of Heat Transfer and Film Thickness in Thin-Film Evaporation

Published:2013-02-08 Issue:3 Volume:135 Page:
ISSN:0022-1481
Container-title:Journal of Heat Transfer
language:en
Short-container-title:

Author:

Yan Chunji¹,Ma H. B.²

Affiliation:

1. Marine Engineering College, Dalian Maritime University Dalian, Liaoning Province, 116024, China

2. Department of Mechanical and Aerospace Engineering, University of Missouri, Columbia, MO 65211 e-mail:

Abstract

A mathematical model predicting heat transfer and film thickness in thin-film region is developed herein. Utilizing dimensionless analysis, analytical solutions have been obtained for heat flux distribution, total heat transfer rate per unit length, location of the maximum heat flux and ratio of conduction thermal resistance to convection thermal resistance in the evaporating film region. These analytical solutions show that the maximum dimensionless heat flux is constant which is independent of the superheat. Maximum total heat transfer rate is determined for a given film region. The ratio of conduction thermal resistance to convection thermal resistance is a function of dimensionless film thickness. This work will lead to a better understanding of heat transfer and fluid flow occurring in the evaporating film region.

Publisher

ASME International

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

http://asmedigitalcollection.asme.org/heattransfer/article-pdf/doi/10.1115/1.4007856/6202564/ht_135_3_031501.pdf

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