Experimental Performance of a Completely Passive Thermosyphon Cooling System Rejecting Heat by Natural Convection Using the Working Fluids R1234ze, R1234yf, and R134a

Author:

Cataldo Filippo1,Thome John Richard2

Affiliation:

1. Laboratory of Heat and Mass Transfer (LTCM), Department of Mechanical Engineering, École Polytechnique Fédérale de Lausanne (EPFL), Station 9, Lausanne CH-1015, Switzerland e-mail:

2. Professor Laboratory of Heat and Mass Transfer (LTCM), Department of Mechanical Engineering, École Polytechnique Fédérale de Lausanne (EPFL), Station 9, Lausanne CH-1015, Switzerland e-mail:

Abstract

The present paper proposes a proof of concept of a completely passive thermosyphon for cooling of power electronics. This thermosyphon is composed of an evaporator to cool down a four-heater pseudo-transistor module and a natural air-cooled condenser to reject the heat into the environment. R1234ze, R1234yf, and R134a are used as the working fluids with charges of 524, 517, and 566 g, respectively, for the low charge tests, and 720, 695, and 715 g for the high charge tests. It has been demonstrated that the refrigerant R1234ze with a low charge is not a good solution for the cooling system proposed here since low evaporator performance and fluid instability have been detected at moderate heat fluxes. In fact, R1234ze needed a larger charge of refrigerant to be safely used, reaching a transistor temperature of 53 °C at a heat load of 65 W. R1234yf and R134a, on the other hand, showed good results for both the low and the high charge cases. The maximum temperatures measured, respectively, were 52 °C and 48 °C at 65 W for the low charge case and 55 °C and 47 °C at 62 W for the high charge case. The corresponding values of overall thermal resistances of the thermosyphon for the working fluids R1234yf and R134a at the maximum heat load are very similar, being in the range of 0.44−0.46 K/W.

Funder

Schweizerischer Nationalfonds zur Förderung der Wissenschaftlichen Forschung

Schweizerischer Nationalfonds zur Forderung der Wissenschaftlichen Forschung

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Cited by 9 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. The thermal performance of the thermosiphon under different parameters: Review study;AIP Conference Proceedings;2024

2. A mass rate-of-rise model for additively manufactured wick structures;International Communications in Heat and Mass Transfer;2023-07

3. Experimental Analysis of a Dual-Evaporator Thermosyphon Cooling System for CPUs and GPUs;2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2022-05-31

4. Thermal performance of a two-phase loop thermosyphon with an additively manufactured evaporator;Applied Thermal Engineering;2022-02

5. Experimental Analysis and Modeling of a Novel Thermosyphon System for Electronics Cooling;Journal of Electronic Packaging;2021-11-05

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3