Affiliation:
1. Department of Mechanical Engineering, Indian Institute of Science, Bangalore 560 012, India
2. Mem. ASME
Abstract
This paper deals with phase change material (PCM), used in conjunction with thermal conductivity enhancer (TCE), as a means of thermal management of electronic systems. Eicosane is used as PCM, while aluminium pin or plate fins are used as TCE. The test section considered in all cases is a 42×42mm2 base with a TCE height of 25mm. An electrical heater at the heat sink base is used to simulate the heat generation in electronic chips. Various volumetric fractions of TCE in the conglomerate of PCM and TCE are considered. The case with 8% TCE volume fraction was found to have the best thermal performance. With this volume fraction of TCE, the effects of fin dimension and fin shape are also investigated. It is found that a large number of small cross-sectional area fins is preferable. A numerical model is also developed to enable an interpretation of experimental results.
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference7 articles.
1. Low Temperature Latent Heat Thermal Storage;Abhat
2. Enhancement of Heat Transfer by Inserting a Metal Matrix Into a Phase Change Material;Tong;Numer. Heat Transfer, Part A
3. Thermal Management of an Avionics Module Using Solid-Liquid Phase Materials;Pal;J. Thermophys. Heat Transfer
4. Thermal Analysis of a PCM Thermal Control Unit for Portable Electronics Devices: Experimental and Numerical Analysis;Alawadhi
5. Thermal Conductivity Enhancement in a Latent Heat Storage System;Mettawee;Sol. Energy
Cited by
100 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Optimising extended fin design and heat transfer coefficient for improved heat transfer and PCM recover time in thermal management of batteries;Applied Thermal Engineering;2024-10
2. Evaluation of solid-solid and solid-liquid phase change materials in pin-finned heat sinks for cooling of avionics electronics;Thermal Science and Engineering Progress;2024-08
3. Numerical investigation and optimisation of solid–solid phase change material composite-based plate-fin heat sink for thermal management of electronic package;Applied Thermal Engineering;2024-07
4. Comparative Study of Solid-Solid and Solid-Liquid Phase Change Materials for a Pin-Finned Heat Sink in Avionics Thermal Management;Proceeding of Proceedings of the 27th National and 5th International ISHMT-ASTFE Heat and Mass Transfer Conference December 14-17, 2023, IIT Patna, Patna-801106, Bihar, India;2024
5. Numerical heat transfer investigation on solid-solid phase change material compositebased plate-fin heat sink for thermal management of electronic package;Proceeding of Proceedings of the 27th National and 5th International ISHMT-ASTFE Heat and Mass Transfer Conference December 14-17, 2023, IIT Patna, Patna-801106, Bihar, India;2024