Numerical investigation and optimisation of solid–solid phase change material composite-based plate-fin heat sink for thermal management of electronic package-Reference-Cited by-同舟云学术

Numerical investigation and optimisation of solid–solid phase change material composite-based plate-fin heat sink for thermal management of electronic package

Published:2024-07 Issue: Volume:248 Page:123183
ISSN:1359-4311
Container-title:Applied Thermal Engineering
language:en
Short-container-title:Applied Thermal Engineering

Author:

Midhun V.C.,Maroliya Mayank,Saha Sandip K.^ORCID

Funder

Department of Science and Technology

Publisher

Elsevier BV

Reference49 articles.

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2. Thermal protection by integration of vacuum insulation panel in liquid-cooled active thermal management for electronics package exposed to thermal radiation;Midhun;J. Therm. Sci. Eng. Appl.,2022

3. Electronics cooling with nanofluids: a critical review;Bahiraei;Energy Convers. Manag.,2018

4. CFD analysis of employing a novel ecofriendly nanofluid in a miniature pin fin heat sink for cooling of electronic components: effect of different configurations;Bahiraei;Adv. Powder Technol.,2019

5. Impact of nanoparticle shape on thermohydraulic performance of a nanofluid in an enhanced microchannel heat sink for utilisation in cooling of electronic components;Bahiraei;Chin. J. Chem. Eng.,2021

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