A Hybrid Thermal Energy Storage Device, Part 2: Thermal Performance Figures of Merit

Author:

Zheng Ning1,Wirtz R. A.1

Affiliation:

1. Mechanical Engineering Department, University of Nevada, Reno, Reno, NV 89557

Abstract

Two figures of merit for hybrid Thermal Energy Storage (TES) units are developed: the volumetric figure of merit, V˜, and the temperature control figure of merit, ΔT˜. A dimensional analysis shows that these quantities are related to the performance specification of the storage unit and its physical design. A previously benchmarked semi-empirical finite volume model is used to study the characteristics of various plate-type TES-unit designs. A parametric study is used to create a database of optimal designs, which is then used to form simple correlations of V˜ and ΔT˜ in terms of design requirements and attributes. A preliminary design procedure utilizing these figures of merit is suggested. Sample calculations show that these correlations can be used to quickly determine the design attributes of a plate-type TES-unit, given design requirements.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Reference10 articles.

1. Leoni, N., and Amon, C., 1997, “Transient Thermal Design of Wearable Computers with Embedded Electronics Using Phase Change Materials,” ASME HTD-Vol. 343, pp. 49–56.

2. Fossett, A. J., Maguire, M. T., Kudirka, A. A., Mills, F. E., and Brown, D. A., 1998, “Avionics Passive Cooling with Microencapsulated Phase Change Material,” ASME J. Electron. Packag., 120, pp. 238–242.

3. Wirtz, R. A., Zheng, N., and Chandra, D., 1999, “Thermal Management Using Dry Phase Change Materials,” Proceedings IEEE Semiconductor Thermal Measurement and Management Symposium, pp. 74–82.

4. Alawadhi, E. M., and Amon, C. H., 2000, “PCM Thermal Storage Unit for Time-Dependent Thermal Management of Electronic Devices,” Proceedings of 34th National Heat Transfer Conference, Pittsburgh, PA, August 20–22.

5. Gurrum, S. P., Joshi, Y. K., and Kim, J., 2000, “Thermal Management of High Temperature Pulsed Electronics Using Phase Change Materials,” Proceedings of 34th National Heat Transfer Conference, Pittsburgh, PA, August 20–22.

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