On the Flow Rate Dynamics in Time-Pressure Dispensing Processes
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Published:2002-12-01
Issue:4
Volume:124
Page:693-698
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ISSN:0022-0434
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Container-title:Journal of Dynamic Systems, Measurement, and Control
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language:en
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Short-container-title:
Author:
Chen, X. B.1, Schoenau, and G.1, Zhang W. J.1
Affiliation:
1. Department of Mechanical Engineering, University of Saskatchewan, 57 Campus Dr., Saskatoon, SK S7N 5A9, Canada
Abstract
Time-pressure dispensing has been widely employed in electronics packaging manufacturing, where the fluid (such as encapsulant, epoxy, adhesive, etc.) in a syringe is driven by pressurized air and delivered onto boards or substrates. In such a process, the flow rate dynamics is critical in controlling the amount of fluid dispensed, yet extremely difficult to represent due to its complex behavior. This paper presents the development of a model of the flow rate dynamics in time-pressure dispensing, taking into account both air compressibility and fluid inertia. Experiments have been conducted to verify the effectiveness of the model developed.
Publisher
ASME International
Subject
Computer Science Applications,Mechanical Engineering,Instrumentation,Information Systems,Control and Systems Engineering
Reference15 articles.
1. Tummala, R. R., and Rymaszewski, E. J., 1989, Microelectronic Packaging Handbook, Van Nostrand-Reinhold, New York. 2. Razbzn, A., 1993, “Intelligent Control of an Automated Adhesive Dispensing Cell,” Ph.D. Thesis, Imperial College, London, UK. 3. Razban, A., and Davies, B. L., 1995, “Analytical Modelling of the Automated Dispensing of Adhesive Material,” J. Adhes. Sci. Technol., 9, pp. 1435–1450. 4. West, A. A., Williams, D. J., and Hinde, C. J., 1995, “Experience of the Application of Intelligent Control Paradigms to Real Manufacturing Processes,” Proc. Inst. Mech. Eng., 209, Pt. 1, pp. 293–308. 5. Dixon, D. et al., 1997, “Practical Issues Concerning Dispensing Pump Technologies,” Circuits Assembly, August, pp. 36–40.
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