Temporary Bonding/Debonding of Silicon Substrates Based on Propylene Carbonate-Reference-Cited by-同舟云学术

Temporary Bonding/Debonding of Silicon Substrates Based on Propylene Carbonate

Published:2015-10-20 Issue:4 Volume:137 Page:
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Zhu Zhiyuan¹,Yu Min²,Liu Lisha³,Jin Yufeng¹

Affiliation:

1. National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Peking University, No. 5, Yiheyuan Road, Haidian District, Beijing 100871, China

2. National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Peking University, No. 5, Yiheyuan Road, Haidian District, Beijing 100871, China e-mail:

3. School of Chemical and Biomolecular Engineering, Georgia Institute of Technology, 311 Ferst Drive NW, Atlanta, GA 30332

Abstract

This paper researches temporary bonding/debonding based on propylene carbonate (PPC). The highest shear strength of 4.1 MPa was achieved when pure PPC was used as bonding adhesive. Room temperature debonding methods were investigated and compared with thermal debonding. Chemical debonding at room temperature was realized for bonding with the pure PPC. Several different chemicals can be used for chemical debonding. A photo acid generator (PAG)-assisted debonding method was demonstrated at room temperature when PAG-loaded PPC (PAG-PPC) was used as bonding adhesive. The ultraviolet (UV) radiation was used to enhance the PAG-assisted debonding.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/doi/10.1115/1.4031750/6140449/ep_137_04_044501.pdf

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