Phase-Change Heat Transfer in Microsystems

Author:

Cheng Ping1,Wu Hui-Ying1,Hong Fang-Jun1

Affiliation:

1. School of Mechanical and Power Engineering, Shanghai Jiaotong University, 800 Dong Chuan Road, Shanghai 200240, P.R. China

Abstract

Recent work on miscroscale phase-change heat transfer, including flow boiling and flow condensation in microchannnels (with applications to microchannel heat sinks and microheat exchangers) as well as bubble growth and collapse on microheaters under pulse heating (with applications to micropumps and thermal inkjet printerheads), is reviewed. It has been found that isolated bubbles, confined elongated bubbles, annular flow, and mist flow can exist in microchannels during flow boiling. Stable and unstable flow boiling modes may occur in microchannels, depending on the heat to mass flux ratio and inlet subcooling of the liquid. Heat transfer and pressure drop data in flow boiling in microchannels are shown to deviate greatly from correlations for flow boiling in macrochannels. For flow condensation in microchannels, mist flow, annular flow, injection flow, plug-slug flow, and bubbly flows can exist in the microchannels, depending on mass flux and quality. Effects of the dimensionless condensation heat flux and the Reynolds number of saturated steam on transition from annular two-phase flow to slug/plug flow during condensation in microchannels are discussed. Heat transfer and pressured drop data in condensation flow in microchannels, at low mass flux are shown to be higher and lower than those predicted by correlations for condensation flow in macrochannels, respectively. Effects of pulse heating width and heater size on microbubble growth and collapse and its nucleation temperature on a microheater under pulse heating are summarized.

Publisher

ASME International

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference31 articles.

1. Integrated Thermal Management Techniques for High Power Electronic Devices;McGlen;Appl. Therm. Eng.

2. Mesoscale and Microscale Phase-Change Heat Transfer;Cheng;Adv. Heat Transfer

3. Heat Transfer Mechanism During Flow Boiling in Microchannels;Kandlikar;J. Heat Transfer

4. Nonuniform Temperature Distribution in Electronic Devices Cooled by Flow in Parallel Microchannels;Hetsronic;IEEE Trans. Compon. Packag. Technol.

5. A Uniform Temperature Heat Sink for Cooling of Electronic Devices;Hetsronic;Int. J. Heat Mass Transfer

Cited by 49 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3