A GA Based Configuration Design Optimization Method-Reference-Cited by-同舟云学术

A GA Based Configuration Design Optimization Method

Published:2004-01-01 Issue:1 Volume:126 Page:6-15
ISSN:1050-0472
Container-title:Journal of Mechanical Design
language:en
Short-container-title:

Author:

Grignon Pierre M.¹,Fadel Georges M.²

Affiliation:

1. Department of Research and Development, Dassault Systemes, Suresnes, France

2. Department of Mechanical Engineering, Clemson University, Clemson, SC

Abstract

This work presents a methodology for optimizing multiple system level assembly characteristics of complex mechanical assemblies by placement of their components. It addresses any component shape (including nonconvex, hollow, sharp edges) connected together by functional constraints. This method presents the designer with multiple solutions to the engineering configuration design problem (ECDP) using a Pareto Genetic Algorithm working on a population of sets instead of a population of individual points and thus results in a more informed a posteriori decision on the tradeoff issues between the various objectives. This paper addresses the definition of the assembly components and their relationships (ECDP), the definition of the configuration design optimization method (CDOM), and shows the application of the CDOM to one academic and two engineering test cases.

Publisher

ASME International

Subject

Computer Graphics and Computer-Aided Design,Computer Science Applications,Mechanical Engineering,Mechanics of Materials

Link

http://asmedigitalcollection.asme.org/mechanicaldesign/article-pdf/126/1/6/5604136/6_1.pdf

Reference30 articles.

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3. Wodziak, J. R., 1994, “Optimal Packing Utilizing Genetic Algorithms,” MS thesis, Mechanical Engineering, Clemson University, Clemson, SC.

4. Grignon, P. M., Wodziak, J. R., and Fadel, G. M., 1996, “Bi-Objective Optimization of Components Packing Using a Genetic Algorithm,” Multidisciplinary Analysis and Optimization, AIAA.

5. Szykman, S., and Cagan, J., 1995, “A Simulated Annealing Approach to Three-Dimensional Component Packing,” ASME J. Mech. Des., 117(2A), pp. 308–314.

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