Optimization design of bamboo filament decorated board process based on response surface

Abstract

Bamboo filament decorated board is a new kind of bamboo and wood composite material. In this material, melamine-urea-formaldehyde (MUF) modified resin impregnated paper is used as the bonding material between bamboo filament decoration material and finger joint plate. This research investigated the effects of hot pressing temperature, time, and pressure on surface bonding properties of bamboo filament decorated board, and the optimum process parameters were determined. With the surface bonding strength as the evaluation index, the response surface analysis was used to optimize the design of the optimal hot pressing process. The optimum surface bonding strength of 1.13 MPa was achieved with the process parameters of 130 s (hot pressing time), 148 °C (hot pressing temperature), and 2.00 MPa (hot pressing pressure). The experimental values were in good agreement with the predicted ones, and the relative error was less than 5%, showing the optimized result.