Influence of cutting wedge treatment on cutting power, machined surface quality, and cutting edge wear when plane milling oak wood

Author:

Koleda Peter1,Barcík Štefan1,Svoreň Ján1,Naščák Ľubomír1,Dobrík Andrej1

Affiliation:

1. Technical University in Zvolen

Abstract

The cutting power value, the surface quality of the machined surfaces, and the cutting edge wear were determined in the planar milling of oak wood (Quercus robur L.). The experimental tool was a milling head with two interchangeable blades. The basic material of the three milling cutters was HS 18-0-2-5 high-speed steel (ISO 4957 2018). Two milling blades were treated with different coatings: a multilayer AlTiCrN coating of thickness 1 μm to 4 μm (knife B) and a multilayer MoC coating of thickness 1 μm (knife C). Parameters for the experiment were as follows: tool angular geometry: α = 30°, β = 45°, γ = 15°, and δ = 75°; spindle speed: 3000 min-1, 4000 min-1, and 5000 min-1; feed rate: 6 m/min, 8 m/min, 10 m/min, 12 m/min, and 14 m/min; cutting depth: 1 mm and 2 mm. The results showed that the cutting power for face milling increased with milling length for all three blades. The greatest power was measured at milling using the knife C (mean value of 209.3 W). The wedge wear parameter WBW increased with milling length; knife C reached the greatest value (WBW = 54.0 μm at length of 270 m). The surface quality parameter (Ra) of the machined surfaces was almost unchanged with increasing milling length beyond 90 m for all knives.

Publisher

BioResources

Subject

Waste Management and Disposal,Bioengineering,Environmental Engineering

Cited by 8 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3